Molded part and electronic device using the same

专利名称：Molded part and electronic device using the

same

发明人：Katsuhide Oohashi,Shigeo Amagi,Osamu

Miyo

申请号：US11320782申请日：20051230

公开号：US20060186522A1公开日：20060824

专利附图：

摘要：An integrally multiple-molded part for electronic devices is provided capable ofabsorbing and relieving the internal stresses of a multiple-molded part, preventing the

occurrence of clearances between the bonding side face of each electrical connectionterminal and a resin, obtaining stable frictional force at the contact region between thebonding surface of the electrical connection terminal and an aluminum wire, obtaining theenergy required for bonding, and achieving high bondability. The surface of the moldedelectrical connection terminal section formed as a primary-molded article becomesexposed after secondary molding, and a stress-absorbing structure is formed in theprimary molding resin section of the primary-molded article that serves as a transmissionpath for stresses associated with the resin shrinkage occurring when the secondarymolding resin is cured.

申请人：Katsuhide Oohashi,Shigeo Amagi,Osamu Miyo

地址：Mito JP,Naka-gun JP,Hitachi JP

国籍：JP,JP,JP

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