专利名称:Method of producing through-hole in
aromatic polyimide film
发明人:Tomohiko Yamamoto,Katsumi
Kato,Toshinori Hosoma,Shuichi Hashiguchi
申请号:US09941890申请日:20010828
公开号:US20020023906A1公开日:20020228
专利附图:
摘要:A polyimide film favorably employable in a method of producing a through-hole in an aromatic-polyimide film having on its surface a laminated or deposited metal
film by applying laser beam onto the polyimide film, preferably is composed of a high Tgaromatic polyimide layer which has a Tg of 300° C. or higher or has no noticeable Tg andis produced from a biphenyltetracarboxylic acid compound and an aromatic diaminecompound and a low Tg aromatic polyimide layer which has a Tg of lower than 375° C. buthigher than 200° C., provided that the Tg of the low Tg polyimide layer is lower than theTg of the high Tg polyimide layer and the metal film is laminated or deposited on thesurface of the low Tg polyimide layer on the side not facing the high Tg polyimide layer.
申请人:UBE INDUSTRIES, LTD.
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