Semiconductor device including a plurality of inpu

专利名称：Semiconductor device including a plurality of

input buffer circuits receiving the samecontrol signal

发明人：Tadaaki Yamauchi申请号：US08/978972申请日：19971126公开号：US05801451A公开日：19980901

摘要：A control signal applied to a lead terminal is transmitted to metal wires andbonding pads. The control signal arriving at the bonding pads are provided at high speedfrom the lead terminal to the input nodes of input buffer circuits via interconnectionlayers with almost no difference in the signal transmission time delay. The input buffercircuits can be disposed in close proximity to a desired circuit controlled by the samecontrol signal and also in close proximity to any of the bonding pads. The length of theinterconnection layers for connecting an input node of an input buffer circuit with acorresponding bonding pad can be reduced, so that the difference in the signaltransmission time delay can be neglected. Thus, a high speed semiconductor device isprovided that can have the signal delay difference of a control signal applied to the inputbuffers reduced.

申请人：MITSUBISHI DENKI KABUSHIKI KAISHA

代理机构：McDermott, Will & Emery

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